Latest about Hot Chips 2026
Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory
Premium Samsung detailed the industry's first LPDDR5X-PIM at Hot Chips 2026, adding logic directly to memory to speed up data-intensive workloads like AI inference.
Hot Chips 2026: Intel details cutting-edge tech in entry-level Wildcat Lake
Premium Intel's Wildcat Lake is competing in the budget laptop market, but it takes a very different approach, leveraging a UCIe interconnect and Intel's latest 18A node.
Hot Chips 2026: Intel dives deep on Crescent Island AI accelerator
Premium Xe3P focuses on the most compute-intensive phases of AI inference.
Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation
Premium Micron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.
Hot Chips 2026: Nvidia breaks down 88-core Vera CPU
Premium Nvidia has provided more color on its Vera CPU for agentic data centers at Hot Chips 2026, showcasing the benefits of spatial multithreading and the power benefits of the LPDDR5X memory system.
Hot Chips 2026: Intel Xeon 7 'Diamond Rapids' comes with up to 256 P-cores, 1.28 GB of last-level cache
Premium Intel has pulled back the curtain on its next-gen Diamond Rapids Xeon CPUs, packing up to 256 P-cores and 1.28 TB of last-level cache.
Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling
Premium The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
Hot Chips 2026: IBM's first dual-ISA core natively executes ARM and z/Architecture in the same core; all cores run at 5.7 GHz base frequency
Premium IBM is vastly expanding softwarte support on its mainframes with its first dual-ISA CPU core that natively supports z/Architecture and ARM instructions.
