Latest about Hot Chips 2026
Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor
Premium Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.
Hot Chips 2026: Cerebras lays out the future of wafer-scale AI
Premium You're gonna need a bigger chip.
Hot Chips 2026: OpenAI's Jalapeño AI ASIC unpacked
Premium How OpenAI used AI to build its AI ASIC.
Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark
Premium Igor Arsovski, now Nvidia's VP of hardware, presented the Groq 3 LPX rack's architecture and published the first third-party benchmark of the hardware.
Hot Chips 2026: Nvidia touts benefits of its DSX MaxLPS site power management approach
Premium Real-time monitoring, dynamic allocation, and smarter planning are all needed for maximum performance from a Rubin installation.
Hot Chips 2026: Fujitsu's Monaka CPU stacks its entire cache on a separate 5nm die and narrows to 256-bit SVE2
Premium Fujitsu details its Monaka server CPU
Hot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limited
Premium OXMIQ presented its High Bandwidth Flash (HBF) use-case scenarios at Hot Chips 2026, which dramatically narrow the circumstances under which HBF makes sense.
Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card
Premium Heading into production during the tightest DRAM market in more than a decade.
