Latest about Hot Chips 2026
Premium Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.
Premium You're gonna need a bigger chip.
Premium How OpenAI used AI to build its AI ASIC.
Premium Igor Arsovski, now Nvidia's VP of hardware, presented the Groq 3 LPX rack's architecture and published the first third-party benchmark of the hardware.
Premium Real-time monitoring, dynamic allocation, and smarter planning are all needed for maximum performance from a Rubin installation.
Premium Fujitsu details its Monaka server CPU
Premium OXMIQ presented its High Bandwidth Flash (HBF) use-case scenarios at Hot Chips 2026, which dramatically narrow the circumstances under which HBF makes sense.
Premium Heading into production during the tightest DRAM market in more than a decade.
