Latest about Hot Chips 2026
Premium Intel's Wildcat Lake is competing in the budget laptop market, but it takes a very different approach, leveraging a UCIe interconnect and Intel's latest 18A node.
Premium Xe3P focuses on the most compute-intensive phases of AI inference.
Premium Micron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.
Premium Nvidia has provided more color on its Vera CPU for agentic data centers at Hot Chips 2026, showcasing the benefits of spatial multithreading and the power benefits of the LPDDR5X memory system.
Premium Intel has pulled back the curtain on its next-gen Diamond Rapids Xeon CPUs, packing up to 256 P-cores and 1.28 TB of last-level cache.
Premium The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
Premium IBM is vastly expanding softwarte support on its mainframes with its first dual-ISA CPU core that natively supports z/Architecture and ARM instructions.
