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By Luke James Published
Premium Tower Semiconductor has announced a dual-track expansion of its 300mm silicon photonics, silicon germanium, and advanced packaging operations in Japan

By Etiido Uko Published
Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production

By Anton Shilov Published
Premium Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

By Etiido Uko Published
Researchers created a programmable thermal material that steers heat and retains its state without power, a breakthrough that could benefit AI chips, silicon photonics, and infrared devices.

By Luke James Published
Premium Running until 2035, the $250 billion spending target is attached to a goal of making 40% of Micron's DRAM in the U.S. by the mid-2030s.

By Luke James Published
Intel has unveiled Starfire, a space-grade system-on-chip designed for the U.S. government.

By Luke James Published
Apple's planned M7 Ultra chip is being designed to support up to 1.5 TB of unified memory and to push AI performance toward the class of Nvidia's Blackwell accelerators.

By Etiido Uko Published
SK hynix raised $26.5 billion in a record-breaking Nasdaq IPO, as it plans to channel the windfall from surging AI demand and sold-out HBM supply to fund new fabs.
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