Latest about Manufacturing
Intel's new space-grade Starfire chip is a Panther Lake SoC that puts an 18A CPU into orbit
Intel has unveiled Starfire, a space-grade system-on-chip designed for the U.S. government.
Apple's rumored M7 Ultra targets 1.5TB of memory and Blackwell-class AI performance, report claims
Apple's planned M7 Ultra chip is being designed to support up to 1.5 TB of unified memory and to push AI performance toward the class of Nvidia's Blackwell accelerators.
SK Hynix raises a record $26.5 billion in historic U.S. IPO
SK hynix raised $26.5 billion in a record-breaking Nasdaq IPO, as it plans to channel the windfall from surging AI demand and sold-out HBM supply to fund new fabs.
Japanese chipmaker Rapidus to offer lower wafer pricing than TSMC — 2nm class silicon to be priced around $20,000 on 2027 launch
Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.
Researchers turn HBM on its side to tackle AI memory’s heat wall
Technologies not yet proven as viable HBM alternatives
Micron lifts U.S. spending to $250 billion
Micron has said it will invest up to $3 billion in the US semiconductor supply chain, with $500 million of that going to GlobalWafers.
Rapidus fab roadmap examined
Premium Rapidus is building Japan's entire return to leading-edge logic on one fab in Chitose, Hokkaido.
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
