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By Etiido Uko Published
The company claims its Ascend 950PR delivers approximately 2.87 times the inference performance of Nvidia's H20

By Anton Shilov Published
Intel reportedly solves one of the key issues that plagued its 18A process technology, but others may still be there.

By Anton Shilov Published
Intel begins expansion of its Bowers Campus in Santa Clara to produce more photomasks in-house, which is set to be crucial as process technologies get more sophisticated.

By Anton Shilov Published
Tesla hires an Intel veteran, who most recently was responsible for installing advanced tools at Intel's Arizona fab that is now ramping production of chips using 18A fabrication process.

By Etiido Uko Published
President Lee unveiled an 800 trillion won ($520B) public-private plan for four new Samsung and SK Hynix fabs, dwarfing the US CHIPS Act tenfold.

By Anton Shilov Published
Premium As CPP shrinking stalls, chipmakers find a new way to increase transistor density. Imec foresees 0.3nm in 2038, CFET insertion in 2038, HLSI era.

By Anton Shilov Published
IBM's new 0.7nm-class fabrication process uses nanostack transistors, requires 2x more FEOL steps for massive improvements in performance, power, and area.

By Etiido Uko Published
TSMC has reportedly told customers to prepare for 5% to 10% price hikes across advanced chip nodes, extending beyond 3nm to include 7nm and some legacy processes.

By Mark Tyson Published
We just witnessed a significant semiconductor industry related non-cash trade deal take place on Twitter/X.

By Anton Shilov Published
U.S. Commerce Secretary Lutnick expresses concerns in a conversation with ASML executives that China has an EUV lithography system as ASML denies shipping such scanners to the PRC.
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