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By Luke James Published
OpenAI arrived at Hot Chips on Tuesday with benchmarks claiming its first in-house chip beats Nvidia's GB300.

By Luke James Published
Premium Micron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.

By Luke James Published
Premium The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.

By Luke James Published
A research team at Kyoto University has built a silicon carbide transistor that operates at 600°C (873 K) using ion implantation.

By Anton Shilov Published
Premium LG rolls-out laser direct imaging lithography machine for chip packaging and high-density PCBs.

By Luke James Published
Nvidia has rejected a report published by The Information that it plans to begin small-batch shipments of an LPU tailored for Chinese customers by the end of 2026.

By Luke James Published
Synopsys has published silicon results for what it calls the first 3D PCIe 6.0 test chip, a 5nm PHY built into a face-to-face stacked package.

By Luke James Published
Premium SMIC posted its first $3 billion quarter earlier this month, with revenue up 36.1% year on year, net profit nearly tripling to $479.2 million.
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