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Huawei builds major tool R&D center in Shanghai
By Anton Shilov published
Huawei invests billions in wafer fab equipment research and development to make leading-edge chips.

US CHIPS and Science program puts R&D funding on hold
By Anton Shilov published
The U.S. Commerce Department halts CHIPS funding for R&D facilities.

Samsung to double investment in Texas fab, spend $44 billion to build leading-edge chips: Report
By Anton Shilov published
Samsung to add another fab module, an advanced packaging facility, and an R&D center to its Taylor, Texas, campus.

The US wants ASML to stop servicing its advanced chipmaking tools in China: Report
By Anton Shilov published
The U.S. government plans to ask the Dutch government to force ASML to stop servicing its advanced lithography systems in China.

Taiwan earthquake causes estimated $62 million in damage and disruptions for TSMC
By Mark Tyson published
Insiders talk about broken beams, columns, and cracked walls.

Intel's 18A-based CPUs won't ramp to high volume production until 2026
By Anton Shilov published
Intel's Panther Lake and Clearwater Forest will start production in 2025, but won't ramp to high volume until 2026.

Taiwan hit with 7.4 earthquake, TSMC evacuates some fabs, begins inspections (Updated)
By Avram Piltch published
The biggest quake in 25 years struck off of the island's east coast and chipmakers TSMC and UMC evacuated some factories.

US urges South Korea to join the China sanctions regime, adjust export controls to prevent the country from getting chipmaking tools
By Anton Shilov published
The U.S. hopes to patch another China semiconductor industry loophole.
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