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ASML may be looking to leave the Netherlands — but the Dutch government is desperate to keep it there: Report
By Anton Shilov published
The Dutch government is working on a plan to prevent ASML from leaving the country.
Intel shares biggest unboxing video ever as ASML’s $380 million High-NA lithography machine is installed in Oregon fab
By Anton Shilov published
Intel posts video showing the arrival and installation of its cutting-edge High-NA lithography machine.
Intel Foundry is trying to poach Samsung's South Korean customers in its bid to become world's second-biggest foundry: report
By Matthew Connatser published
In its drive to become a heavyweight in semiconductor manufacturing, Intel is trying to take Samsung's clients.
Chinese foundry SMIC is bruised but not broken by U.S. sanctions — revenue still much higher than in 2021 and 5nm node on track
By Matthew Connatser published
Although SMIC had a rough 2023, the long term may actually be positive for the foundry according to a report.
Researchers reveal chips that commit 'circuit suicide' — self-destruction and counterfeit protection in one
By Christopher Harper published
As part of several anti-hacking measures introduced at ISSCC this year, a University of Vermont team created a self-destructing fingerprinting mechanism for different circuits.
Chinese chipmaker defeats US DOJ espionage charges — found not guilty of IP theft from Micron
By Matthew Connatser published
Chip and memory manufacturer Fujian Jinhua was found not guilty on economic espionage charges.
Intel and ASML achieve 'First Light' milestone with world's most advanced chipmaking tool
By Anton Shilov published
ASML and Intel achieve first light on wafer milestone with ASML's Twinscan EXE:5000 lithography system for the first time.
Applied Materials receives multiple subpoenas from U.S government agencies over shipments to China
By Anton Shilov published
Leading U.S. wafer fab equipment maker under investigation for supplying fab tools to Chinese chipmakers.
$300 million of CHIPS Act R&D funds is officially up for grabs as U.S Department of Commerce opens applications for packaging technology
By Matthew Connatser published
The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.
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