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TSMC's equipment requirements have nearly doubled in just eight months as AI demand drives an unprecedented fab expansion, yet its 2026 CapEx budget has risen by only around 15%.
Premium Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic and freshly postponed on memory.
Despite rumors, there is no evidence that Chinese makers of lithography tools can produce immersion lithography scanners in quantity.
Premium Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.
German and Japanese researchers demonstrate a heat-driven elastocaloric cooler that uses shape-memory alloys to turn waste heat into cooling.
David Zinsner, chief financial officer of Intel, boasted at a conference
Premium Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023, are now in final qualification but still not in a single commercial product
These chemicals are crucial for semiconductor manufacturing, but they must also come with a lot of safety rules to prevent them from leaking out and poisoning the environment.
