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New memory demoed running at 600 degrees Celsius for 60 hours
By Christopher Harper published
Researchers from the University of Pennsylvania show off ferrodiode memory devices with the world's finest heat resist.
New PCB design is repeatably recyclable
By Christopher Harper published
vPCBs, which are PCBs built with a sustainable and recyclable vitrimer polymer, debut. This contrasts with traditional PCBs which are 'basically impossible to recycle.'
US sanctions transform China into legacy chip production juggernaut
By Aaron Klotz published
China's legacy chip production has skyrocketed since U.S. export sanctions took effect. In Q1 2024, China's legacy chip production was three times what it was in Q1 2019.
U.S. blacklists Intel's and Nvidia's key partner in China
By Anton Shilov published
The U.S. government added Sitonholy, one of China's largest solution providers based on Intel and Nvidia processors, to the Entity List.
Nanotronics promises modular, shippable chip fab facilities powered by Nvidia GPUs and AI
By Christopher Harper published
Nanotronics' switch fabrication units start at 1,715 square meters.
Huawei builds major tool R&D center in Shanghai
By Anton Shilov published
Huawei invests billions in wafer fab equipment research and development to make leading-edge chips.
US CHIPS and Science program puts R&D funding on hold
By Anton Shilov published
The U.S. Commerce Department halts CHIPS funding for R&D facilities.
Samsung to double investment in Texas fab, spend $44 billion to build leading-edge chips: Report
By Anton Shilov published
Samsung to add another fab module, an advanced packaging facility, and an R&D center to its Taylor, Texas, campus.
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