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![Chips on map of China](https://cdn.mos.cms.futurecdn.net/sS6PSzWqprKMArtPujYaP7-320-80.jpg)
US chip toolmakers skip Semicon China conference they sponsored amid ongoing trade war
By Matthew Connatser published
Several of Semicon China's U.S.-based sponsors skipped the conference, as did companies like Micron and ASML.
![SK Hynix Fab](https://cdn.mos.cms.futurecdn.net/u2vFAJWsC7iEi9W5P5P9iZ-320-80.jpg)
SK hynix to spend $90 billion to build 'world's largest mega fab complex' — first fab operational in 2027
By Matthew Connatser published
Termed the Yongin Semiconductor Cluster, SK hynix's upcoming quadruple fab complex will be the largest in the world.
![Alphawave](https://cdn.mos.cms.futurecdn.net/3bv6ZK9EUi2WLJsZvLko33-320-80.jpg)
Ultra Ethernet Consortium adds 45 new members in five months – aiming for version 1.0 to connect HPC and AI clusters this year
By Anton Shilov published
45 additional members join the Ultra Ethernet Consortium to enable next-generation connectivity for AI and HPC applications.
![Intel Ohio progress](https://cdn.mos.cms.futurecdn.net/VCiEhQySo3shh6NeB8zdXD-320-80.jpg)
Intel pushes launch date of Ohio fab from 2025 to 2027 or 2028
By Mark Tyson published
Intel reports that its Ohio fab won't be operational until 3 years later than originally reported.
![Wafer](https://cdn.mos.cms.futurecdn.net/Q5LCCvZxX9YWFkiiSutLmD-320-80.jpg)
U.S. outlines five-year plan to harness CHIPS Act funds
By Matthew Connatser published
The National Science and Technology Council has published its five-year strategy to make the most of the CHIPS Act.
![ASML](https://cdn.mos.cms.futurecdn.net/8NPZWfb6kiGvxJkaKLtiX9-320-80.jpg)
ASML delivers cutting-edge new chipmaking tool
By Anton Shilov published
ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.
![XMC](https://cdn.mos.cms.futurecdn.net/bZWaX5JszuErZeRgH4ULjY-320-80.jpg)
Chinese foundry XMC aims to produce HBM memory
By Anton Shilov published
Yangtze Memory may jump into the HBM memory business via its XMC foundry unit.
![Intel](https://cdn.mos.cms.futurecdn.net/gUKxnKN82CaQ6SNg2CpejW-320-80.jpg)
Samsung races to beat Intel to market with glass substrates for chips — revolutionary tech boosts processing capabilities
By Anton Shilov published
Intel forms strategic alliance to develop and commercialize usage of glass substrates.
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