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Researchers detail revolutionary new X-ray tech for seeing inside computer chips
By Mark Tyson published
Researchers have detailed a new X-ray technique that can see inside computer chips to reveal crisp and clear 3D images. Unlike prior practical investigative methods, this one is non-destructive.
Researchers developing next generation 2D semiconductors investigate potential silicon replacement
By Jowi Morales published
The Princeton Plasma Physics Laboratory is working on how it can induce defects on TMDs and create materials with the desired electrical properties that will replace silicon for our chips.
Researchers grow sub-nanometer size transistors
By Mark Tyson published
1D metals demonstrated in 2D semiconductor circuits.
U.S. government addresses critical workforce shortages for the semiconductor industry with new program
By Anton Shilov published
The NSTC intends to allocate grants between $500,000 and $2 million to 10 workforce development projects.
Nvidia Omniverse used by researchers to analyze and improve stacked chip designs in 3D
By Aaron Klotz published
As chips adopt 3D stacking technologies, designers will need to see these chips in 3D.
China only produces 1% of critical litho chipmaking tools, exposing it to harsh US sanctions
By Jowi Morales published
Only 20% of China's chipmaking tools are domestically made, putting the country at the mercy of external forces.
Rampant speculation of blacklisted Huawei becoming China’s largest beef importer stems from an odd payment method for telecom equipment
By Jeff Butts published
In an odd story that hasn't been officially corroborated, Huawei may be accepting so much beef as payment for its goods that it has become China's largest importer of the commodity.
Huawei exec concerned over China’s inability to obtain 3.5nm chips, bemoans lack of advanced chipmaking tools
By Jeff Butts published
Speaking at an industry conference in China, a Huawei executive expressed concerns about China's near future in the semiconductor industry under U.S. sanctions.
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