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Nvidia Omniverse used by researchers to analyze and improve stacked chip designs in 3D
By Aaron Klotz published
As chips adopt 3D stacking technologies, designers will need to see these chips in 3D.
China only produces 1% of critical litho chipmaking tools, exposing it to harsh US sanctions
By Jowi Morales published
Only 20% of China's chipmaking tools are domestically made, putting the country at the mercy of external forces.
Rampant speculation of blacklisted Huawei becoming China’s largest beef importer stems from an odd payment method for telecom equipment
By Jeff Butts published
In an odd story that hasn't been officially corroborated, Huawei may be accepting so much beef as payment for its goods that it has become China's largest importer of the commodity.
Huawei exec concerned over China’s inability to obtain 3.5nm chips, bemoans lack of advanced chipmaking tools
By Jeff Butts published
Speaking at an industry conference in China, a Huawei executive expressed concerns about China's near future in the semiconductor industry under U.S. sanctions.
Nvidia CEO says Samsung HBM3e is not yet ready for AI accelerator certification
By Jeff Butts published
In a recent discussion with reporters, Nvidia's CEO Jensen Huang said the GPU maker is still working on certification for Samsung's most advanced HBM chips for AI use.
STMicroelectronics receives $2.2B to build the world’s first silicon carbide factory
By Jowi Morales published
The EU is investing in domestic chip production by investing €2B ($2.2B) in STMicroelectronics's ground-breaking silicon carbide facility.
Former SK hynix employee charged with stealing tech for Huawei
By Jeff Butts published
An unidentified Chinese national who once worked for South Korea's SK hynix allegedly took more than 3,000 pages worth of proprietary technology printouts to Huawei
Micron's plans for an additional DRAM fab in Hiroshima delayed until 2027
By Jeff Butts published
Micron plans to build a second memory factory in Japan to manufacture its most advanced products, including high-bandwidth memory. The latest news is that the second plant won't be ready until 2027.
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