Manufacturing

Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.

Technologies not yet proven as viable HBM alternatives

Micron has said it will invest up to $3 billion in the US semiconductor supply chain, with $500 million of that going to GlobalWafers.

Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.

The company claims its Ascend 950PR delivers approximately 2.87 times the inference performance of Nvidia's H20

Intel reportedly solves one of the key issues that plagued its 18A process technology, but others may still be there.

Intel begins expansion of its Bowers Campus in Santa Clara to produce more photomasks in-house, which is set to be crucial as process technologies get more sophisticated.

Tesla hires an Intel veteran, who most recently was responsible for installing advanced tools at Intel's Arizona fab that is now ramping production of chips using 18A fabrication process.

President Lee unveiled an 800 trillion won ($520B) public-private plan for four new Samsung and SK Hynix fabs, dwarfing the US CHIPS Act tenfold.