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Zombie fabs plague China's chipmaking ambitions, failures burning tens of billions of dollars
By Anton Shilov published
28 fabs later

AI is eating up Pennsylvania's power, governor threatens to pull state from the grid — new plants aren't being built fast enough to keep up with demand
By Jon Martindale published
Spiking demand is sending energy bills skyrocketing, while the governor threatens to pull the state from the grid.

IBM's new Power11 server chips are focused on two things: AI and ransomware
By Nathaniel Mott published
The company says the new servers can detect ransomware attacks within a minute of their start.

Nvidia AI challenger Groq announces European expansion — Helsinki data center targets AI market
By Jon Martindale published
Premium Positioning itself as leaner and faster at inference workloads, Groq is hoping to outcompete Nvidia at its own game.

Popular industry security tool repurposed by cybercriminals to deploy infostealer malware
By Nathaniel Mott published
The developers behind a popular industry security tool say it has been repurposed by hackers, but blame a research group for not disclosing a vulnerability months earlier.

U.S. imposes 25% tariffs on all products from Japan and South Korea
By Anton Shilov published
They'll take effect from August 1

Japanese shipping company partners with Turkish outfit to build a 73MW floating data center
By Jowi Morales published
Japanese shipping line MOL has partnered with Turkish floating power generation company Karpowership to build a 73-megawatt floating data center.

Trump says he has struck a trade deal with Hanoi
By Jowi Morales published
Premium The U.S. and Vietnam have reached a tentative agreement that sets tariffs on Vietnamese goods at 20%, but hits transshipments with a 40% import tax.

Chipmaking giant TSMC hit with class-action lawsuit in the U.S. for bias, racism, and unsafe conditions — over 30 plaintiffs have accused the company of illegal practices at Arizona fab
By Anton Shilov published
Problems continue.

LG Innotek to slim down smartphones by replacing solder balls with copper posts
By Anton Shilov published
LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
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