DDR5 continues to evolve with higher speeds, larger capacities, and new technologies like CUDIMMs and MRDIMMs, solidifying its dominance through the decade as DDR6 remains years away.

We put our thinking caps on to come up with a desktop GPU roadmap for all brands, with all of the expected details for what's to come for Nvidia, AMD, and Intel's next-generation architectures.

Bigger drives, a new controller, and a larger LDPC enabled by new tech.

We've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E.

The 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.

Systems are planned to be up to 14 times faster than NVL72 by 2027.

Micron detailed its $200 billion U.S. investment plan to build six DRAM fabs and HBM assembly facilities in the U.S. over the next 20 years.

TSMC plans to build or ramp up nine new production facilities in 2025 — the highest in its history — as it accelerates global expansion to meet demand and rising manufacturing complexity.