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PremiumSamsung's fab roadmaps examinedDivided across two countries and four campuses, Samsung's fab roadmap runs from the Korean bases at Pyeongtaek, Hwaseong, and Giheung to the new U.S. site at Taylor.
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PremiumChinese chipmaking tool roadmaps examined — Beijing's nascent lithography tools target DUV production at five machines a year, and an EUV prototype with no chipsUltimately, three markers will indicate whether China’s domestic DUV program is a legitimate rival or yet more state-sanctioned hot air.
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PremiumCo-Packaged Optics (CPO) foundry roadmaps — breaking down TSMC, Intel, Samsung, and GlobalFoundries' approach to next-generation scale-up connectivityThe CPO race is about to begin.
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PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraintsHuawei eyes up extreme system-level scaling.
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PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decadeCompetition for Nvidia looms.
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PremiumThe future of DRAM: From DDR5 advancements to future ICsDDR5 continues to evolve with higher speeds, larger capacities, and new technologies like CUDIMMs and MRDIMMs, solidifying its dominance through the decade as DDR6 remains years away.
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PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 CelestialWe put our thinking caps on to come up with a desktop GPU roadmap for all brands, with all of the expected details for what's to come for Nvidia, AMD, and Intel's next-generation architectures.
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News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPCBigger drives, a new controller, and a larger LDPC enabled by new tech.
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PremiumInside the future of 3D NAND: The roadmap to 500 layersThe 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.
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PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyondWe've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E.
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PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonicsSystems are planned to be up to 14 times faster than NVL72 by 2027.
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News AnalysisMicron details new U.S. fab projects — HBM production coming to AmericaMicron detailed its $200 billion U.S. investment plan to build six DRAM fabs and HBM assembly facilities in the U.S. over the next 20 years.
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