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OpenAI raises $110 billion in largest-ever private tech funding round, Nvidia throws in $30 billion
By Luke James published
$50 billion from Amazon, $30 billion from Nvidia, and $30 billion from SoftBank, with additional investors expected to join as the round progresses.

Device that can extract 1,000 liters of clean water a day from desert air revealed by 2025 Nobel Prize winner
By Mark Tyson published
Stand-alone device claimed to pull 1,000 liters (about 264 US Gal) of drinkable water a day from air with as little as 20% humidity.

Two suspects arrested over theft of $1.5 million in Bitcoin stolen from police custody in outrageous blunder
By Jowi Morales published
The authorities found out about the theft of 22 BTC from the Gangnam Police Station during the investigation of another case of missing Bitcoin from government custody.

Trump bans Anthropic AI from federal agencies after firm refuses to unlock capabilities
By Luke James published
"We don’t need it, we don’t want it, and will not do business with them again," said Trump.

Amazon invests $50 billion in OpenAI, comitting to 2 gigawatts of Trainium silicon
By Luke James published
Premium The investment is part of a $110 billion funding round that values OpenAI at $730 billion pre-money, with Nvidia and SoftBank each contributing $30 billion.

Anthropic refuses to lower AI guardrails for The Pentagon
By Hassam Nasir published
CEO Dario Amodei takes a strong stance against the Pentagon.

ISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
By Luke James published
Premium Taking to the stage at ISSCC, AMD’s Ramasamy Adaikkalavan talked through how AMD managed to fit nearly double the compute throughput into the same die area as its predecessor,

Rapidus secures $1.7 billion from Japan’s government and private investors for 2nm chip production
By Luke James published
Under the arrangement, the government will initially hold roughly 10% of Rapidus's voting shares and the majority of its stake in non-voting stock.

Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips
By Anton Shilov published
Increased oxygen concentration during the EUV lithography post-exposure bake step can increase photoresist performance by 15% - 20%, according to Imec's findings.
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