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Samsung reshuffles semiconductor execs after poor performance in memory and NAND competitiveness
By Anton Shilov published
Samsung promotes semiconductor division head to CEO position, chief of Samsung's American microelectronics operation to oversee foundry business.
TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks
By Anton Shilov published
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
Washington D.C. gets AI-enabled air defense camera upgrade
By Jowi Morales published
The U.S. is getting new air defense cameras that use machine learning to help track and identify aircraft flying in or around the Washington metropolitan area.
Qualcomm reportedly loses interest in Intel takeover
By Anton Shilov published
Qualcomm is not interested in buying Intel anymore but could consider separate parts of it.
Intel and U.S. ink funding contract
By Anton Shilov published
Intel to get $7.86 billion under CHIPS & Science Act, $3 billion under Secure Enclave program.
AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new tech
By Anton Shilov published
AMD obtains a glass substrate patent that could be used for next-generation datacenter and PC products.
Microsoft Word and Excel AI data scraping slyly switched to opt-in by default
By Anton Shilov last updated
Microsoft's 'optional' Connected Experiences enable Microsoft to use Excel and Word files to train its AI technology, but it is possible to turn this feature off.
US to reportedly sanction 200 more Chinese chip firms — high bandwidth memory might also see export bans
By Hassam Nasir published
The latest round of US sanctions imposes tighter control over the export of US technology to 200 more chip makers in China.
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