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Oracle reportedly delays several new OpenAI data centers because of shortages
By Anton Shilov published
Oracle reportedly delays some of the data centers for OpenAI from 2027 to 2028, citing labor and materials shortages.

Huawei's latest mobile is armed with China's most advanced process node to date despite using blacklisted chipmaker
By Anton Shilov published
But not a 5nm-class node.

Photonic latch memory could enable optical processor caches that run up to 60 GHz, twenty times faster than standard caches
By Luke James published
A joint research paper describes a "photonic latch" with write speeds pushing 20 GHz.

Intel tests chipmaking tools from sanctioned China-focused tool maker, report claims
By Anton Shilov published
Intel has evaluated wet etch tools from ACM Research for its 14A fabrication process, raising political and national security concerns.

China mulls $70 billion domestic chip fabrication injection, would be largest of any government semiconductor investment
By Jon Martindale published
Huawei and Cambricon are seen as likely candidates for investment.

Rivian unveils its own in-house RAP1 AI chip and ACM3 self-driving platform
By Bruno Ferreira published
Rivian's ACM3 module and RAP1 chip outshine Tesla with LiDAR support

TSMC ponders upgrading 2nd Japan fab to 4nm
By Anton Shilov last updated
TSMC reportedly mulls making 4nm chips in Japan amid putting construction of Fab 23 phase 2 on pause.

Cambricon targets 500,000 AI chips in 2026 as China accelerates domestic hardware push
By Luke James published
Premium Cambricon Technologies is preparing one of the most aggressive production ramp-ups attempted by a Chinese AI chipmaker.
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