ASML

Chinese companies aggressively recruiting personnel from ASML and Zeiss to build their own wafer fabbing equipment.

Before tightening export controls, U.S. legislators want to learn about sales of American producers of chipmaking tools to China-based entities.

TSMC is set to receive its first shipment of ASML's High NA EUV machine later this year.

ASML lowers its 2025 outlook because of normalization of demand from China, Intel's delay of European fabs, and overall spending in the semiconductor sector.

Corning introduces new Extreme ULE glass for photomasks and mirrors to be used with next-generation EUV and High-NA EUV tools.

The Chinese government says domestic companies have developed litho tools capable of 65nm and 110nm resolution.

Shanghai Microelectronics Equipment patents key components of an EUV lithography tool.

The Chinese government is not satisfied with the Dutch government's decision to export control ASML's Twinscan NXT:1970i and 1980i.

Russian companies get spare parts for ASML's PAS 5500 lithography steppers from 1990s – 2000s through China-based intermediaries.

ASML's advanced DUV tools installed at Chinese fabs may become inoperable next year if the Dutch government bans their service by ASML.