EUV
Latest about EUV
U.S.-China Trade War Could Make All Memory Fabs in China Inefficient
By Anton Shilov published
SK Hynix's plans for Wuxi, China fab upgrade reportedly falls victim of U.S.-China trade war.
Samsung's 5-Layer EUV DDR5 in Production, DDR5-7200 ICs Incoming
By Anton Shilov published
Samsung mass produces DDR5 using 5-layer EUV node, promises DDR5-7200 chips.
Intel: Upcoming US Fab Will Be a Small City, to Cost $60 to $120 Billion
By Anton Shilov published
Intel to build a multi-module fab campus near a major city with universities.
Samsung Hikes Chip Production Prices: GPUs, SoCs Set to Get More Expensive
By Anton Shilov published
To meet chip demand in the future, Samsung intends to increase IC production prices now.
Samsung Developing 24Gb DDR5 ICs: 768GB DDR5 Modules Possible
By Anton Shilov published
Samsung's 24Gb DDR5 DRAM chips to boost memory capacity of client PCs and servers.
Intel Considering German Fab Near Munich
By Anton Shilov published
Intel is talking to the German state of Bavaria about building a fab, possibly near Munich.
Intel Seeks $9.7 Billion Subsidies for European Fab
By Anton Shilov published
Intel sees Germany, Benelux as good candidates for European fab.
Intel's 7nm Fab Construction Crew Hit by COVID-19 Outbreak
By Anton Shilov published
Intel confirms over 70 workers infected with COVID-19 at fab construction site in Ireland.
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