Latest about EUV
ASML: Demand for Chip Tools Hits Record, Backlog Exceeds $38 Billion
ASML sees record demand for chip production equipment despite U.S. sanctions against Chinese chip sector.
Intel Begins Construction of $100 Billion Ohio Campus
Intel begins to build an its all-new manufacturing site in decades.
Wafer Maker to Invest $5 Billion in the U.S. to Serve Intel, Samsung, TSMC
GlobalWafers to invest $5 billion in the U.S. wafer production as new fabs from Intel, Samsung Foundry, and TSMC loom.
Industrial Firms Raid Washing Machines to Secure Prized Microchips
According to ASML CEO Peter Wennink, some of its customers have resorted to purchasing washing machines to obtain certain chips.
Intel to Invest Up to $100 Billion in New Ohio Mega Site
Intel to make initial investments of $20 billion in two new fabs in Ohio.
Intel Delays $200 Billion Decision on New Fab Sites
Intel will announce $200 billion in new fab sites in Europe and the U.S. in 2022.
U.S.-China Trade War Could Make All Memory Fabs in China Inefficient
SK Hynix's plans for Wuxi, China fab upgrade reportedly falls victim of U.S.-China trade war.
Samsung's 5-Layer EUV DDR5 in Production, DDR5-7200 ICs Incoming
Samsung mass produces DDR5 using 5-layer EUV node, promises DDR5-7200 chips.