EUV

Smaller, faster transistors at unprecedented speed.

ASML and TSMC have added kill switches to advanced EUV lithography machines to prevent them from falling into the wrong hands.

TSMC says it will not need a high-NA litho tool for its A16 technology but will keep exploring it for A16 and beyond.

Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon.

ASML begins to ship its High-NA EUV lithography system to the second customer

ASML has reached another milestone with its Twinscan EXE:5000 lithography system.

1.7 million files were swiped by Hunters International, say reports.

Samsung to add another fab module, an advanced packaging facility, and an R&D center to its Taylor, Texas, campus.

Insiders talk about broken beams, columns, and cracked walls.

ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.