Latest about EUV
Intel and ASML achieve 'First Light' milestone with world's most advanced chipmaking tool
ASML and Intel achieve first light on wafer milestone with ASML's Twinscan EXE:5000 lithography system for the first time.
ASML explores Hyper-NA chipmaking tools as the next step in shrinking transistors
ASML mulls Hyper-NA lithography with a higher than 0.7 numerical aperture in 2030s.
Equipment delivery to Intel's Ohio fab delayed for several weeks
The transportation of Intel's oversized equipment to its Ohio fab is delayed to February 17.
Intel's Ohio fabs could reportedly slip to late 2026 — 'Silicon Heartland' factories were originally planned for 2025
Intel reportedly delays $20 billion Ohio fab project due to govt incentives and chip demand.
ASML fires back at accusations that its next-gen High-NA EUV chipmaking tools are too expensive
ASML asserts that its next-generation High-NA EUV tools have numerous advantages over existing Low-NA tools.
ASML triples order bookings in Q4 2023 thanks to demand for EUV tools
Driven by pre-orders for advanced wafer fab equipment, ASML's orders bookings increased to $10 billion in Q4 2023.
Billions in German subsidies secured for Intel and TSMC Fabs
German coalition finally agrees to provide Intel and TSMC billions of Euros in funding.
Germany vows to subsidize Intel and TSMC fabs despite budget crisis
Germany vows to subsidize Intel and TSMC fabs despite a budget crisis, though Intel and Wolfspeed reportedly received firm fab funding commitments from the German government.
