Latest about EUV
Intel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 14A process development in 2025
Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon.
ASML ships its second High-NA EUV litho tool to unspecified client
ASML begins to ship its High-NA EUV lithography system to the second customer
ASML sets density record with latest chipmaking tools — High-NA EUV equipment prints first patterns
ASML has reached another milestone with its Twinscan EXE:5000 lithography system.
Critical EUV chipmaking tool supplier hacked, pressed to pay $10 million for ransomware unlock – Hoya dismisses hack as an ‘IT system incident’
1.7 million files were swiped by Hunters International, say reports.
Samsung to double investment in Texas fab, spend $44 billion to build leading-edge chips: Report
Samsung to add another fab module, an advanced packaging facility, and an R&D center to its Taylor, Texas, campus.
Taiwan earthquake causes estimated $62 million in damage and disruptions for TSMC
Insiders talk about broken beams, columns, and cracked walls.
ASML delivers cutting-edge new chipmaking tool
ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.
Samsung rep says High-NA EUV is good for logic, but might have cost issues for memory fabrication
Samsung shares its views on High-NA EIV costs, while other companies present more bullish views.
