Latest about EUV
Tokyo Electron's new tool can reduce the necessity for EUV double patterning and improve yield
Tokyo Electron unveils the Acrevia tool, which can improve patterning with gas cluster beam technology.
Micron is the last memory maker to join the EUV party
Micron reiterates its plans to use EUV for high-volume DRAM production next year as it starts pilot production on a 1-gamma node.
Intel CEO says China must make its own chips if sanctions become too restrictive, points to EUV as key cutoff point
Intel CEO Pat Gelsinger told Tom's Hardware during a question and answer session at Computex 2024 that China must make its own processors if US sanctions on the latest chips become too restrictive.
ASML sets new chipmaking density record, proposes Hyper-NA tools
Smaller, faster transistors at unprecedented speed.
TSMC’s EUV machines are equipped with a remote self-destruct in case of an invasion
ASML and TSMC have added kill switches to advanced EUV lithography machines to prevent them from falling into the wrong hands.
TSMC says it doesn't need High-NA EUV chipmaking tools for 1.6nm-class node, but Intel has championed the tech
TSMC says it will not need a high-NA litho tool for its A16 technology but will keep exploring it for A16 and beyond.
Intel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 14A process development in 2025
Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon.
ASML ships its second High-NA EUV litho tool to unspecified client
ASML begins to ship its High-NA EUV lithography system to the second customer
