Latest about EUV
Rapidus is first Japanese company to install ASML's cutting-edge EUV machine
Rapidus gets ASML's Twinscan NXE:3800E, almost completes its installation.
Russia plans EUV chipmaking tools that it says will be cheaper and easier to build than ASML's
Russia to develop lithography systems that could compete against ASML's Twinscan NXE EUV systems.
ASML made a $230 Lego kit version of its $380 million semiconductor tool
ASML has added the TWINSCAN EXE:5000 Lego set to its growing portfolio of gifts.
TSMC rumored to receive High NA EUV machines from ASML this year
TSMC is set to receive its first shipment of ASML's High NA EUV machine later this year.
New York State to get new $825 million semiconductor R&D facility
The NSTC is getting a flagship facility in Albany, New York, that's dedicated to EUV research and development.
Analyst firm raises alarm about EUV chipmaking tool power consumption
Leading-edge semiconductor fabs to consume 54,000 Gigawatts a year by 2030, which is more than some countries consume today.
Corning's Extreme ULE glass debuts for next-gen High-NA EUV chipmaking
Corning introduces new Extreme ULE glass for photomasks and mirrors to be used with next-generation EUV and High-NA EUV tools.
China's SMEE files patent for an EUV chipmaking tool — tool aims to break the shackles of ASML export restrictions
Shanghai Microelectronics Equipment patents key components of an EUV lithography tool.