Semiconductors

Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.

The company claims its Ascend 950PR delivers approximately 2.87 times the inference performance of Nvidia's H20

Intel reportedly solves one of the key issues that plagued its 18A process technology, but others may still be there.

Intel begins expansion of its Bowers Campus in Santa Clara to produce more photomasks in-house, which is set to be crucial as process technologies get more sophisticated.

Tesla hires an Intel veteran, who most recently was responsible for installing advanced tools at Intel's Arizona fab that is now ramping production of chips using 18A fabrication process.

President Lee unveiled an 800 trillion won ($520B) public-private plan for four new Samsung and SK Hynix fabs, dwarfing the US CHIPS Act tenfold.

IBM's new 0.7nm-class fabrication process uses nanostack transistors, requires 2x more FEOL steps for massive improvements in performance, power, and area.

TSMC has reportedly told customers to prepare for 5% to 10% price hikes across advanced chip nodes, extending beyond 3nm to include 7nm and some legacy processes.