Latest about Semiconductors
Chipmaking giant TSMC hit with class-action lawsuit in the U.S. for bias, racism, and unsafe conditions — over 30 plaintiffs have accused the company of illegal practices at Arizona fab
Problems continue.
LG Innotek to slim down smartphones by replacing solder balls with copper posts
LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
TSMC swats down claims it is delaying its Japan chipmaking plant to prioritize Arizona plants to avoid US tariffs
No smoke without fire, or an unsubstantiated rumor?
Samsung delays $44 billion Texas chip fab
Sources cite that Samsung is delaying the launch of its Taylor, Texas, fab because the site lacks customers for its 4nm-class chip output.
White House lifts chip design export ban on China in exchange for rare earth materials compromise
EDA software in exchange for antimony, gallium, and germanium?
Intel might axe the 18A process node for foundry customers, essentially leaving TSMC with no rival
TSMC's N2 and A16 may have no rivals
AI boom drives explosive demand for leading-edge process nodes
Surging adoption of AI, next-generation technologies is driving semiconductor makers to expand 7nm and more advanced production capacity by 69% through 2028.
China could be the world's top semiconductor foundry hub by 2030
China is projected to become the biggest manufacturer of semiconductors by 2030, but how advanced will these chips be?
Ex-Intel CEO Pat Gelsinger gives Japan's new leading-edge chipmaker advice, says Rapidus needs unique tech to compete with TSMC
Rapidus plans to produce 2nm chip production with integrated packaging by 2027, but ex-Intel CEO Pat Gelsinger cautions that it needs unique technology to compete with TSMC.
