Semiconductors
Latest about Semiconductors
US chip toolmakers skip Semicon China conference they sponsored amid ongoing trade war
By Matthew Connatser published
Several of Semicon China's U.S.-based sponsors skipped the conference, as did companies like Micron and ASML.
SK hynix to spend $90 billion to build 'world's largest mega fab complex' — first fab operational in 2027
By Matthew Connatser published
Termed the Yongin Semiconductor Cluster, SK hynix's upcoming quadruple fab complex will be the largest in the world.
Intel pushes launch date of Ohio fab from 2025 to 2027 or 2028
By Mark Tyson published
Intel reports that its Ohio fab won't be operational until 3 years later than originally reported.
U.S. outlines five-year plan to harness CHIPS Act funds
By Matthew Connatser published
The National Science and Technology Council has published its five-year strategy to make the most of the CHIPS Act.
Intel shares biggest unboxing video ever as ASML’s $380 million High-NA lithography machine is installed in Oregon fab
By Anton Shilov published
Intel posts video showing the arrival and installation of its cutting-edge High-NA lithography machine.
Intel Foundry is trying to poach Samsung's South Korean customers in its bid to become world's second-biggest foundry: report
By Matthew Connatser published
In its drive to become a heavyweight in semiconductor manufacturing, Intel is trying to take Samsung's clients.
Chinese foundry SMIC is bruised but not broken by U.S. sanctions — revenue still much higher than in 2021 and 5nm node on track
By Matthew Connatser published
Although SMIC had a rough 2023, the long term may actually be positive for the foundry according to a report.
Chinese chipmaker defeats US DOJ espionage charges — found not guilty of IP theft from Micron
By Matthew Connatser published
Chip and memory manufacturer Fujian Jinhua was found not guilty on economic espionage charges.
Applied Materials receives multiple subpoenas from U.S government agencies over shipments to China
By Anton Shilov published
Leading U.S. wafer fab equipment maker under investigation for supplying fab tools to Chinese chipmakers.
$300 million of CHIPS Act R&D funds is officially up for grabs as U.S Department of Commerce opens applications for packaging technology
By Matthew Connatser published
The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.
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