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Samsung to Produce 300-Layer V-NAND in 2024: Report
By Anton Shilov published
Samsung to use double-stack architecture for 300-layer 3D V-NAND memory, according to a leak.
Used DDR4 RAM Chips Are Being Snuck Into New RAM Kits and Devices
By Francisco Pires published
Used DDR4 chips are being re-flashed and sold below market price for new products. This has introduced a glut of supply into the DDR4 market, leading to further drops in DDR4 pricing.
TeamGroup Launches JEDEC-Compliant DDR5-6400 for Raptor Lake Refresh CPUs
By Zhiye Liu published
TeamGroup's Elite and Elite Plus memory modules are now available at DDR5-6400 with 1.1V and very loose timing.
AMD 4800S Xbox Chip Shows Perils of Pairing CPUs with GDDR6
By Aaron Klotz published
Digital Foundry recently tested an AMD 4800S desktop kit, featuring an Xbox Series SoC, and found the chip provides underwhelming performance due to its high-latency GDDR6 memory.
Micron Preps 32Gb DDR5 Chips, Opens Door to 1TB Modules
By Anton Shilov published
Micron readies 32GB DDR5 ICs, 128GB+ RDIMMs in 1H 2024.
SK Hynix Sees DRAM Market Recovery Due to AI Servers
By Anton Shilov published
SK Hynix says demand for HBM and DDR5 memory drives revenue growth.
Micron's New HBM3 Gen2 is World's Fastest at 1.2 TB/s, Teases Next-Gen at 2 TB/s+
By Paul Alcorn published
Micron announced that its HBM3 Gen2 memory, which is the Fastest, densest and most power efficient yet, is now sampling to its partners.
How To Check RAM Usage in Windows
By Sydney Butler published
Whether you have oodles of RAM or are barely scraping by, it’s important to know whether your memory is being used efficiently or if something has gone awry.
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