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CAMM2 benchmarks show similar performance to normal DIMMs
By Aaron Klotz published
MSI benchmarked Kingston's DDR5-7200 C38 CAMM with CKD on the brand's Z790 Project Zero Plus motherboard to evaluate its performance against standard DDR5 modules.

SK hynix says its 3D DRAM is half as expensive to produce
By Anton Shilov published
SK hynix says adopting 4F2 structures and 3D transistors will increase the cost-efficiency of EUV lithography usage in DRAM production.

G.Skill launches ultra-low-latency RAM for Intel and AMD CPUs
By Aaron Klotz published
G.Skill has unveiled a new high-performance DDR5 memory spec aimed purely around performance. The new kit has a very low latency configuration of DDR5-6400 with a CAS latency 30.

Pick up 32GB of speedy 6000 MHz Team T-Force Vulcan DDR5 memory for only $86
By Stewart Bendle published
Snag a deal on 32GB of DDR5 6000 memory with the Team T-Force Vulcan memory kit for only $86.

SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.
By Anton Shilov published
SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.

Chinese companies are stockpiling HBM2E chips ahead of new U.S. export rules
By Anton Shilov published
Baidu, Huawei, and Tencent are stockpiling Samsung's HBM2E memory to use with their own AI processors.

Samsung mass produces 'world's thinnest' LPDDR5X
By Anton Shilov published
Samsung's new LPDDR5X uses 12nm technology to free up space in mobile devices.

JEDEC's new standards will double DDR5 bandwidth, enable faster memory for laptops
By Jowi Morales published
JEDEC plans to introduce multiplexed memory to double the bandwidth of current DDR5 RDIMMs on servers and data centers. It's also working on adding LPDDR6 to CAMM2 for laptops.
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