With the upcoming launch of Intel's Nehalem CPUs, the highly integrated CPU means a boost for corresponding flip-chip (FC) substrate demand is likely as more substrates are required for new designs, according to industry players. Of the Nehalem lineup, Bloomfield, which will pack the processor and memory controller, as well as possibly more northbridge functions such as a GPU in a multi-chip-package (MCP), will demand more substrate layers, implying a larger size of substrate.
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