China poised to break 5nm barrier — Huawei lists 5nm processor presumably built with SMIC tech, defying U.S. sanctions

SMIC
(Image credit: SMIC)

Chinese foundry SMIC may have broken the 5nm process barrier, as evidenced by a new Huawei laptop listed with an advanced chip with 5nm manufacturing tech — a feat previously thought impossible due to U.S sanctions.

This year, SMIC shocked the world after it began mass production of Huawei's HiSilicon Kirin 9000S processor using its second-gen 7nm process technology. But the company seems to have at least one more trick up its sleeve: a 5nm fabrication process that is either already in use for high-volume manufacturing (HVM) or is in the final stages of its development. In fact, Huawei now lists a chip made on a 5nm-class process node — an eight-core Arm-based HiSilicon Kirin 9000C processor with Arm Mali-G78 graphics for laptops — on its website.

A posting on Huawei's website claims the Qingyun L540 laptop is "equipped with the Kirin 9006C chip, utilizing a 5nm process technology, eight cores, with a maximum clock speed of up to 3.13 GHz, offering higher performance, lower power consumption, and faster processing speeds."

The Kirin 9006C's general-purpose cores are listed at up to 3.13 GHz, which is only slightly lower than the clocks that TSMC and Apple could wring out of the original TSMC N5 process technology (the maximum frequency for Apple's M1 high-performance cores is 3.20 GHz). Meanwhile, the Kirin 9006C's peak clock rate looks similar to another chip, the Kirin 9000, which was produced for Huawei by TSMC. 

Indeed, when TSMC began to produce chips made on its N5 (5nm-class) fabrication technology in mass quantities in early Q2 2020, Huawei was not blacklisted by the U.S. Department of Commerce, and the foundry could still ship 5nm chips — which it did in huge volumes. Huawei formally introduced its TSMC N5-based Kirin 9000 SoC in late August 2020 and confirmed that the chip was made in Taiwan.

There are many similarities between the Kirin 9000 and the Kirin 9006C, which some might argue indicates Huawei is leveraging stock it obtained three years ago for its current PCs. While this could be true, keeping a massive quantity of premium processors (which were expensive to make on TSMC's then leading-edge node) for three years doesn't make a lot of sense, especially bearing in mind that the original Kirin 9000 featured a built-in 5G modem (something the Kirin 9006C presumably lacks) and could be used for a premium smartphone rather than for an inexpensive laptop. As such, it is possible that the company has turned to SMIC to create the processors.

It isn't entirely surprising that SMIC could have broken through the 5nm barrier, as persistent industry chatter has indicated the foundry is close to further exceeding the limits imposed by US sanctions. "SMIC is preparing a 5nm process through DUV, and photomask usage is expected to increase further," an expert in the semiconductor industry recently told The Elec.

While an anonymous commenter is not a particularly reliable source, this isn't the first time that SMIC's 5nm technology, which relies solely on deep ultraviolet (DUV) lithography, has been mentioned. SMIC briefly mentioned its post-7nm fabrication process in late 2020, and an industry expert further reemphasized SMIC's 5nm ambitions in September 2022. Both comments indicate that SMIC has been working on a DUV-only 5nm node for quite some time. The technology may be ready by now, but there isn't an independent confirmation yet.

SMIC does have chipmaking tools that could conceivably be used to create 5nm processors. The ASML Twinscan NXT:2000i features a ≤38nm resolution, which is good enough for 7nm-class mass production using double-patterning lithography techniques. However, a finer resolution is required for 5nm-class process technologies. Chipmakers can use triple or even quadruple patterning to produce it. This lithographic technique involves splitting a complex pattern into several simpler patterns, which are then printed sequentially to achieve higher precision and detail. Multi-patterning is a tricky process that affects yields and the number of chips per wafer that can be used, so typically, it has been limited due to its impact on chip costs.  

We don't know for sure whether SMIC has initiated mass production of chips on its 5nm-class technology. Given the tensions between the U.S. and China in general and curbs against Huawei and SMIC in particular, it is unlikely that either company will fully disclose its actual technological capabilities. On the one hand, it is prestigious to produce 5nm-class chips despite the U.S. crackdown; on the other hand, neither Huawei nor SMIC want their partners and tool suppliers (or how they obtain equipment or actual chips) to be discovered by the U.S. and its allies.

Anton Shilov
Freelance News Writer

Anton Shilov is a Freelance News Writer at Tom’s Hardware US. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.

  • usertests
    Very interesting indeed. Not really a surprise since it was known they wanted to use DUV to make a 5nm class node.

    U.S. Cannot Halt China's Semiconductor Advance to 5nm: Ex TSMC VP
    Reply
  • TCA_ChinChin
    I think this probably the farthest Chinese chipmakers are going to be easily go with DUV and existing stockpiles of chipmaking technology. Its not surprising they managed to make this with technology and equipment that they either had beforehand or arent being sanctioned as being bleeding edge. The true test for domestic Chinese chipmakers are the process nodes and improvements going forwards. Whether they keep up their development pace for 3 nm class products and other improvements will be the true indicator of the fruits for Chinese semiconductors. Progress from here will signal whether US sanctions have had their desired impact.
    Reply
  • thisisaname
    Not how affective the US sanctions are if they are still allowed to import chip manufacturing machines.
    Reply
  • Co BIY
    thisisaname said:
    Not how affective the US sanctions are if they are still allowed to import chip manufacturing machines.

    The effectiveness of these sanctions are obviously limited in effectiveness because they are designed to be limited in economic damage.

    This is more like a ritual combat with the semiconductor sectors as the champions of their side. Looks at least analogous to the Space Race in the Cold War.

    In both cases the competence demonstrated by the sides is a proxy for economic and military strength.
    Reply
  • Co BIY
    TCA_ChinChin said:
    I think this probably the farthest Chinese chipmakers are going to be easily go with DUV and existing stockpiles of chipmaking technology. Its not surprising they managed to make this with technology and equipment that they either had beforehand or arent being sanctioned as being bleeding edge. The true test for domestic Chinese chipmakers are the process nodes and improvements going forwards. Whether they keep up their development pace for 3 nm class products and other improvements will be the true indicator of the fruits for Chinese semiconductors. Progress from here will signal whether US sanctions have had their desired impact.

    Another possibility is that Chinese companies will be able to produce adequate chips (in quality and quantity) to allow China to progress at a moderate pace or just maintain it's current economic status quo. I'm not sure they need to be internationally competitive in the free market for semiconductors to meet CCP goals.
    Reply
  • wicked-warlock
    It is not rocket science. China stole the tech or someone is working with them against the US sanctions. How many companies are capable of making 5nm labs ? I know this answer; you can narrow it down by just that info alone.
    Reply
  • TCA_ChinChin
    Co BIY said:
    Another possibility is that Chinese companies will be able to produce adequate chips (in quality and quantity) to allow China to progress at a moderate pace or just maintain it's current economic status quo. I'm not sure they need to be internationally competitive in the free market for semiconductors to meet CCP goals.
    Thats certainly possible. I imagine there is a grey area where Chinese semiconductors are at a performance level where they meet CCP goals, but are a little short of being truly competitive on the international stage.
    Reply
  • Co BIY
    wicked-warlock said:
    It is not rocket science. China stole the tech or someone is working with them against the US sanctions. How many companies are capable of making 5nm labs ? I know this answer; you can narrow it down by just that info alone.

    It is probably harder than Rocket Science - (Although, the Chinese also invented Rocket Science)

    Or the world's largest manufacturer, with the second largest economy and the second largest population in the world was able to assign a high priority to a development goal and assign it large levels of resources in money, people and attention. They are probably also more than willing to color outside the lines.

    That they've had some success is not surprising.

    I'm sure that those in charge of the sanctions regime are not surprised.
    Reply
  • edzieba
    TCA_ChinChin said:
    I think this probably the farthest Chinese chipmakers are going to be easily go with DUV and existing stockpiles of chipmaking technology. Its not surprising they managed to make this with technology and equipment that they either had beforehand or arent being sanctioned as being bleeding edge. The true test for domestic Chinese chipmakers are the process nodes and improvements going forwards. Whether they keep up their development pace for 3 nm class products and other improvements will be the true indicator of the fruits for Chinese semiconductors. Progress from here will signal whether US sanctions have had their desired impact.
    Lack of EUV (assuming China does not develop a domestic capability) will put a price floor on fabbing due to the need for multipatterning, but that's about it. EUV and high-NA EUV are drivers for decreased production cost from reducing the number of patterning steps (which also increases yield, by removing opportunities for defects) but actual feature scale is not a significant factor - feature size has been well below illumination wavelength for several decades, and even with EUV feature size remains below illumination wavelength.
    Reply
  • nookoool
    I'm in the camp that they are TSMC leftovers that they are trying to get rid of. Doesn't make sense that they are expending production for these (low yield) as they are backlog by 1-3 months on the Kirin 9000s already.
    Reply