Intel's next-gen cellphone chips likely to include SM 3.0 capability

Chicago (IL) - Among the armada of new Intel processors that are scheduled to hit the market in 2006 is a replacement for the XScale PXA270 processor: The "Hermon" platform will include a faster CPU, which could be complemented by a Shader Model 3.0 capable graphics processor that is based on technology blueprints provided by Imagination Technologies.

The news of a possible bump in 3D graphics power for Intel's upcoming cellphone platform comes as Imagination Technologies, a British IP company that develops graphics cores, announced that it has licensed its PowerVR SGX chip to Intel.

Peter McGuinness, business development director for the company in the US, told TG Daily that he expects that 3D will become important for the mobile phone space and that the technology may take the same route as on the PC. "Within four years," he said, "80% of cellphones will be 3D capable." While Imagination's designs will increase in performance over time, McGuiness said that the company aims to balance performance and battery power. Wit a power consumption of about 25 mW for the current MBX part, he believes that Imagination currently has the most power efficient graphics chip on the market. In terms of performance, he considers the firm's designs to be "competitive."

The SGX and also Intel's PXA2900 are being scheduled to be released in Q2 of this year, but they are not expected to be available in commercial products anytime soon. Designing, developing and building a new cellphone consumes time - typically about 18 months. McGuinness expects SGX-based graphics chips to be available in phones by the end of 2007 or early 2008.

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