TSMC details 12.8 Tbps on-package optical communications — an efficient silicon photonics interconnect for AI

Alphawave
(Image credit: Alphawave)

Rumors about TSMC having a silicon photonics program have been around for a long time, and at its Northern American Technology Symposium 2024, the company finally outlined its solution. The goal is to improve on-package connectivity, spanning all the way to 12.8 Tbps of bandwidth.

"As we bring more computational capability into the mass packaging, data transfers become a challenge, but we find ourselves often limited by the I/O vendors," said Kevin Zhang, Vice President of Business Development at TSMC. "At TSMC, we have spent many, many years working on silicon photonics. We have the capability to bring silicon photonics close to the switching elements in order to create a very energy efficient high-speed signaling to address the future computation requirement."

Silicon photonics is set to be a game-changer for future datacenters due to increasing bandwidth demands that copper signaling just cannot meet. TSMC's silicon photonics technology relies on the Compact Universal Photonic Engine (COUPE) that combines a 65nm electronic integrated circuit (EIC) with a photonic integrated circuit (PIC) using the company's SoIC-X packaging technology. TSMC claims that its SoIC-X interconnection has very low impedance, which means that COUPE is very efficient in terms of power usage.

(Image credit: TSMC)
Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.

  • Diogene7
    I am wondering if the integration of this silicon photonics technology could help create an Apple Pro Display XDR, that would have the same kind of connector used to connect to the Apple Pro stand (the magnetic circle) but that would also integrate silicon photonics connectivity : this would allow relocating the I/O to the bottom of the stand, and have integrated optical fibers inside the stand to transfer data from I/O (Thunderbolt 4, HDMI,…) to the display…
    Reply
  • Lucky_SLS
    Aimed at data center, might trickle down to mainstream products in 10 years?
    Reply
  • HaninTH
    Lucky_SLS said:
    Aimed at data center, might trickle down to mainstream products in 10 years?
    More likely, 20+ years as the industry has been talking about SiPho for at least 20 years with Intel showing some early progress 10+ years ago.

    Will be interesting to see this technology realized.
    Reply
  • Lucky_SLS
    HaninTH said:
    More likely, 20+ years as the industry has been talking about SiPho for at least 20 years with Intel showing some early progress 10+ years ago.

    Will be interesting to see this technology realized.

    In this case, the adaption would be quicker as TSMC is releasing the tech for its customers. Its not locked to Intel. So chip designers would readily adapt them if the price and performance proves beneficial.
    Reply
  • bit_user
    Lucky_SLS said:
    In this case, the adaption would be quicker as TSMC is releasing the tech for its customers. Its not locked to Intel. So chip designers would readily adapt them if the price and cost proves beneficial.
    Right now, I can't even see a use case for this in consumer machines. That doesn't mean it won't happen within 10 years, but I just can't see far enough ahead to have an idea of what sorts of problems would justify it.
    Reply
  • Lucky_SLS
    bit_user said:
    Right now, I can't even see a use case for this in consumer machines. That doesn't mean it won't happen within 10 years, but I just can't see far enough ahead to have an idea of what sorts of problems would justify it.

    Apple: challenge accepted XD
    Reply