Huawei Announces HiSilicon K3V3 Chipset For Smartphones

Huawei Device chairman Richard Yu has confirmed the development of the HiSilicon K3V3 chipset.

The chipset is the successor to the Chinese smartphone manufacturer's current quad-core K3V2. It's currently scheduled for a launch sometime during the second half of 2013.

Similarly to Nvidia's upcoming Tegra 4, the HiSilicon K3V3 chipset is based on the Cortex-A15 ARM architecture as opposed to the Cortex-A9.

Yu hinted that the K3V3 will be featured in the successors to both the Ascend D2 and the Ascend Mate. Huawei claims the former is the world's most powerful smartphone, which sports a 1.5GHz K3V2 quad core CPU -- read our hands-on impressions here.

The Ascend Mate, meanwhile, is claimed to feature the world's largest phone screen currently available on the market. The device has a 6.1-inch 720p screen and is powered by a Hi-Silicon 1.5 GHz quad-core processor -- for more on the device and its sheer size, head on over to our hands-on impressions.

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  • heero yuy
    Huawei: we are going to compete against Samsung (etc)
    everyone: not going to happen

    and now look
    it seems that they are actually working on putting out some quality products