Die shot of Huawei's HiSilicon Kirin 9000s shows four high-performance cores, two energy-efficient cores, massive image signal processor.
AMD has announced the details of its A620 motherboard for the Ryzen 7000 processors, including a slide deck with more technical details.
Apple's M1 Max chip appears to be hiding a die-to-die interconnect bus on its underside, perhaps unlocking the ability to create chiplet-based designs.
A new leak shows us further details of Intel's Z690 chipset designed for Alder Lake, with PCIe Gen5 and mixed DDR4/DDR5 support.
Western Digital is prepping a new firmware to recover the lost performance on the WD Black SN850 M.2 NVMe SSD.
Alder Lake 600 series chipsets will not support the PCIe Gen 5.0 standard. Instead, it will be limited to Gen 4.0 with an x4 configuration.
Samsung is likely to soon regain the top position as the largest semiconductor manufacturer in the world, surpassing Intel for the 2nd time since 2016.
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