Amkor Builds $1.6 Billion Advanced Chip Packaging Factory

Ponte Vecchio
(Image credit: Intel)

Amkor, the world’s second-largest outsourced semiconductor assembly and test (OSAT) service provider, is set to open its new advanced packaging facility in Vietnam this week. The company is established to spend about $1.6 billion on the first two phases of the plant, which will focus on producing advanced multi-chiplet system-in-packages with HBM memory.

The advanced chip packaging facility spans 57 acres within the Yen Phong 2C Industrial Park. The fab will feature 200,000 m2 of specialized cleanroom space, quite an immense production capacity. To put it into context, GlobalFoundries’s Fab 1 in Dresden had a cleanroom space of around 52,000 m2 as of 2021, and the total cleanroom space owned by the foundry was 255,000 m2 as of 2021. Such a sizable area is designed to satisfy the growing demands of the semiconductor industry for advanced packaging methods that involve silicon interposers. Meanwhile, the company does not disclose the production capacity of the facility in terms of wafers per month/year and million hours of testing per month/year.

Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.

  • HaninTH
    Good bye my sweetheart, hello Vietnam?

    Anything that could help productions ramp up and hopefully drive down consumer pricing is welcomed!
    Reply