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The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond
By Luke James published
Premium ASIC-based AI server shipments are projected to reach 27.8% of the market in 2026, the highest share since 2023, and custom ASIC shipments will grow 44.6% year-over-year.

AMD begins production ramp of 256-core EPYC Venice
By Luke James published
AMD has announced that its 6th Gen EPYC processor, codenamed Venice, has entered production ramp on TSMC's N2 process in Taiwan.

Intel kicks off development on next-decade 10A and 7A process technologies
By Anton Shilov published
Intel says its 14A process technology is on track for high-volume manufacturing in 2029, 10A and 7A to follow in the 2030s.

SMIC founder and AMEC CEO urge Chinese fabs to test domestic chipmaking tools on active production lines
By Luke James published
Premium China's semiconductor equipment vendors collectively posted record revenues in 2025, but profitability is under pressure from domestic price competition.

Russia’s Mikron is selling framed test wafers with up to 120,000 processors as souvenirs
By Mark Tyson published
Russia’s Mikron is earning a bit of cash on the side by selling picture-framed test wafers as souvenirs with 12 designs to choose from, priced around $170.

Trump calls $14 billion Taiwan arms deal a 'negotiating chip' with China after Xi said Taiwan issue could lead to 'clashes and even conflicts'
By Luke James published
Trump's remarks came at the close of a two-day summit with Chinese President Xi Jinping.

Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond
By Anton Shilov published
Premium 2nm is here, so what's next?

TSMC allocates $20 billion to Arizona expansion
By Anton Shilov published
Despite challenges, TSMC is optimistic about Fab 21.

NASA partners with Microchip to build next-generation spaceflight chips with 100x the power of current offerings
By Jowi Morales published
These chips are designed to power the next golden age of space exploration.

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration
By Luke James published
The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's EMIB technology.
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