AMD Reports Successful Production Of Full-field EUV Test Chip

San Jose (CA) - Researchers from AMD and IBM apparently have reached a milestone in advancing chip production technology, creating a path to semiconductors with structures of 16 nm and smaller.

According to the announcement, AMD and IBM have succeeded in producing a 45 nm chip using Extreme Ultra-Violet (EUV) lithography across its entire 22 mm x 33 mm area. While the chip was created using 193 nm Deep Ultraviolet (DUV) technology in AMD's Fab 36 in Dresden, Germany, a 13.5 nm ASML EUV lithography scanner installed in IBM's Research Facility at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York was used to pattern the first layer of metal interconnects between the transistors built in Germany. According to AMD, the transistors of the test chip showed "characteristics very consistent with those of test chips built using only 193 nm immersion lithography."

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Wolfgang Gruener is an experienced professional in digital strategy and content, specializing in web strategy, content architecture, user experience, and applying AI in content operations within the insurtech industry. His previous roles include Director, Digital Strategy and Content Experience at American Eagle, Managing Editor at TG Daily, and contributing to publications like Tom's Guide and Tom's Hardware.