TSMC Follows Intel and Invests in 450 mm, EUV Production

Following a massive investment from Intel amounting to $4.1 billion, foundry TSMC has also agreed to sink money in to the company to accelerate chip manufacturing technology. TSMC invests $339 million into research targeting the development of Extreme Ultraviolet (EUV) and 450 mm lithography tools. TSMC also acquired a 5 percent stake in ASML for $1.03 billion.

Intel previously committed $680 million toward 450 mm development and about $340 million toward EUV. For about $3 billion, Intel received a 15 percent share in ASML.

"We welcome TSMC to our Customer Co-Investment Program. The objective of the Co-Investment program is to secure and accelerate key lithography technologies. These technologies will benefit the entire industry and are not restricted to our Co-Investment partners," said Eric Meurice, Chief Executive Officer of ASML, in a prepared statement.

ASML said it is offering an additional 5 percent stake to willing investors.

The investment program is designed to reduce the individual cost of the development of next-generation manufacturing tools for chip manufacturers. Intel was first to launch the current 300 mm wafer production generation back in 2001 with its Tualatin Pentium III processors.


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  • alidan
    larger surface area, more chip yield per waffer, and more profit for close to same production cost,

    it makes sense to invest in it.
  • Anonymous
    Yay! My company made the news.!
    This is good news, as TSMC goes in early on