Northbridge migration from PBGA to FC packages on hold until cost drops
News
By From the Web
published The migration from plastic ball-grid array (PBGA) to flip-chip (FC) packaging for northbridge chips will not proceed much further this year, as VIA Technologies, ATI Technologies and Nvidia will continue using PBGA packaging for their solutions, according to industry sources.
Sources at VIA indicated that the company has decided to continue using PBGA-packaged northbridge chips this year, as the price difference between FC and PBGA packaging remains significant.
More here at DigiTimes.
Stay on the Cutting Edge
Join the experts who read Tom's Hardware for the inside track on enthusiast PC tech news — and have for over 25 years. We'll send breaking news and in-depth reviews of CPUs, GPUs, AI, maker hardware and more straight to your inbox.
More about pc gaming
No comments yet
Comment from the forums