Researchers Can Now Reverse Engineer Entire Chips With X-Ray Technology

Artistic image showing in grayscale a 3D virtual slices representation of the chip. Image: PSI

Researchers from the University of Southern California, as well as the Swiss Federal Institutes of Technology and the Paul Scherrer Institute (PSI) in Switzerland have invented a new non-destructive technique to reverse engineer an entire chip without damaging it. The technique is called ptychographic X-ray laminography and is actually an upgrade to a technique called ptychographic computed tomography that the researchers first announced in 2017.

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Lucian Armasu is a Contributing Writer for Tom's Hardware US. He covers software news and the issues surrounding privacy and security.

  • martel80
    This is not so simple. After getting the complete transistor + interconnect layout, you would need some kind of synthesis tool in order to guess (interpret) what part of chip serves what high-level function.
    Reply
  • mortemas
    Hmmm, maybe shielding the internals of the chip with a layer of Pb would be a good countermeasure
    Reply
  • bit_user
    mortemas said:
    Hmmm, maybe shielding the internals of the chip with a layer of Pb would be a good countermeasure
    Some chips are allegedly bonded to their heatspreader with solder. However, I don't know if that ever contains lead, or how much lead you'd actually need to effectively block these x-rays.

    I wonder if this can be used for troubleshooting, or to measure things like metal migration.
    Reply