AMD: Instinct MI300 APU with Zen 4 and CDNA 3 Up and Running in the Lab

Mark Papermaster, chief technology officer of AMD, said at a conference that the company's next-generation Instinct MI300 accelerated processing unit for data centers and high-performance computing is already up and running in AMD's labs. The APU uses AMD's Zen 4 and CDNA 3 architectures and will power the El Capitan supercomputer that is expected to break the 2 ExaFLOPS barriers sometimes in 2024.

"But with what we announced and have rolled out with our next-generation Instinct that we already have back in the labs, the MI300, it is a true datacenter APU," said Papermaster at the Wells Fargo 2022 TMT Summit (via SeekingAlpha). "It is a CPU and a GPU acceleration that is leveraging the Infinity architecture to share the same memory fully coherently. It is all sharing high-bandwidth memory."

The Instinct MI300 APU is set to power the U.S. Department of Energy's El Capitan supercomputer, which will be installed at the Lawrence Livermore National Laboratory (LLNL) sometime in 2023 and will become fully operational in mid-2024. 

Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.

  • quadibloc2
    I will definitely agree that having both the CPU and a GPU compute accelerator working from unified memory is good. But the Holy Grail? Don't we already have something that also works from unified memory, but is much more flexible, and hence usable, than a GPU accelerator? I'm thinking of the SX-Aurora TSUBASA from NEC, which is, or at least was, the last survivor of the vector supercomputers that began with the Cray I. Although it appears that today both ARM and RISC-V are adding similar capabilities.
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  • bit_user
    it is unclear whether the company will supply the MI300 to any clients outside the supercomputer world in mass quantities next year.
    I think that depends a lot on what socket or form factor it uses. OAM?

    Also, I have to wonder whether it'll have any external DRAM, or if it'll be limited to just the in-package HBM.
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