ARM, the big name in mobile chips, today announced a long-term strategic relationship with GlobalFoundries for processor implementation and circuit optimization.
The partnership will focus on an System-on-Chip enablement program that's built around ARM Physical IP, Fabric IP and Processor IP that will combine with GlobalFoundries’ most advanced High-K Metal Gate semiconductor manufacturing capabilities.
The effort between the two companies will first focus on the ARM Cortex-A9 using a 28nm HKMG process – a process that GlobalFoundries says is a 28nm “Gate First” HKMG technology that is optimized for high performance processing with minimal leakage. This makes it well-suited for mobile solutions such as handsets, smartphones, e-readers and MIDs.
“This announcement reflects our business value and strategy of providing best in class processor implementation by marrying our own processor and physical IP with world class manufacturing semiconductor technology,” said Warren East, chief executive officer, ARM. “This collaboration with GlobalFoundries and their commitment to delivering leading edge technology makes them an ideal partner to accelerate the adoption of ARM processor based technology at 28nm.”
The currently existing ARM Cortex-A8 is used in the Apple iPhone 3GS and Palm Pre.
Either way its good.
The end of the evil empire is near.
Not to be confused with Silicon on Insulator (SOI) which is used for CPUs, Global Foundries won't have that ready until late 2010.
Not sure that this, specifically, is a good process for desktop chips, though. Low leakage means lower overclocks, even if the feature size is smaller. Embedded chips have traditionally been optimized to reduce leakage while desktop chips have not, to allow for overclocking headroom.
Though Intel has made a handful of 22nm chips.
Just like Intel 22nm chips, these 28nm chips chips are still a while away.
32nm will be for AMD's cpu's, the next one after that will be 22nm, due in 2011-2012.