ASML pushes EUV for sub 22 nm lithography

ASML has reiterated its positive outlook for extreme ultraviolet (EUV) as the mainstream lithography light source when going to deep submicron production while its closely-tied pure-play foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) said it is happy to see multiple choices for light sources at the deep submicron level, according to company executives during the ongoing SEMICON Taiwan 2006 show.

While ASML has admitted that industry players have not yet reached a consensus on light source adoption for 32nm design rules, the company stressed that EUV is the most cost-competitive solution for sub 22nm production, according to company executive vice president of marketing and technology Martin van den Brink.

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