Latest about Manufacturing
The current state of Hybrid Bonding in 2026
Premium Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic and freshly postponed on memory.
China's EUV technology 'at a similar stage to ASML in 2004,' analyst claims
Despite rumors, there is no evidence that Chinese makers of lithography tools can produce immersion lithography scanners in quantity.
Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor
Premium Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.
Motorless solid-state cooler uses heat to cool itself; could recycle processor heat into cooling
German and Japanese researchers demonstrate a heat-driven elastocaloric cooler that uses shape-memory alloys to turn waste heat into cooling.
Intel 14A defect density is dropping faster than the company expected
David Zinsner, chief financial officer of Intel, boasted at a conference
Glass substrate roadmaps examined — Absolics in final qualification and a first product that keeps slipping
Premium Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023, are now in final qualification but still not in a single commercial product
EPA faces lawsuit over claims it fast-tracked approval of toxic 'data center chemicals'
These chemicals are crucial for semiconductor manufacturing, but they must also come with a lot of safety rules to prevent them from leaking out and poisoning the environment.
Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark
Premium Igor Arsovski, now Nvidia's VP of hardware, presented the Groq 3 LPX rack's architecture and published the first third-party benchmark of the hardware.
