Latest about Manufacturing
Lip-Bu Tan says Intel will remain a part of Elon Musk's Terafab project as Musk wants TSMC to sublease a part of the facility.
Premium Qualcomm will license patents behind Huawei’s LogicFolding, according to one report, as a teardown shows off the Kirin 9050 Pro’s two dies.
Huawei and Qualcomm sign a multi-year patent cross-license covering 5G and AI, with Qualcomm buying some Huawei US patents.
Centre for Technology & Statecraft (CTS) calls for banning exports of all immersion DUV tools to China, echoes the MATCH Act by U.S. legislators.
ZNTC completes development of Russia's first 130nm-capable lithography stepper, which could be used to produce chips sometimes late this decade, or rather early next.
Elon Musk and TSMC reportedly discuss multiple collaboration opportunities within the Terafab project.
Premium Cadence, Synopsys, and Siemens all offer agentic AI for chip design, largely built on Nvidia's stack, with varying claims of autonomy.
OpenAI says AI-assisted Jalapeño chip design "established a new baseline" for the industry, and there is already a lot of interest from others to learn how the company pulled it off.
