Samsung Rings B-Die Memory Death Knell
Overclockers love Samsung's B-Die memory, but the company is unceremoniously killing it off. According to the consumer DIMM section of Samsung’s latest Product Guide, B-Die memory "dies," M-Die matures, A-Die ascends, and 32GB UDIMMs really are available in Q2 2019.
We’ve yet to see whether A-die chips will have the overclocking flexibility to match or exceed that of the current B-Die products that have become the memory of choice for overclockers on Intel and AMD platforms alike.
The new A-Die offers the advantage of higher available chip density, particularly to module assemblers/programmers (i.e., the companies we’re accustomed to supplying our XMP-rated DIMMs). The 16Gb (sixteen gigabit) M-Die chips that were supposed to have brought us 32GB consumer DIMMs a year ago appear to have been reserved for Samsung’s own-brand modules, and the best guess from our suppliers has been that the server sector has drawn that supply dry.
4.7 260Pin DDR4 Non ECC UDIMM
[Table9]260 Pin DDR4 Non ECC UDIMM
Density | PartNumber | Composition | Comp.Version | InternalBanks | Rank | Height | Avail. | |
2GB | M378A5644EB0 | 256Mx16*4pcs | 4Gb | E-die | 8 | 1 | 30mm | EOL '181Q |
4GB | M378A5244CB0 | 256Mx16*4pcs | 8Gb | C-die | 8 | 1 | 30mm | MP |
4GB | M378A5244BB0 | 256Mx16*4pcs | 8Gb | B-die | 8 | 1 | 30mm | EOL '191Q |
4GB | M378A5244BB0 | 256Mx16*4pcs | 8Gb | B-die | 8 | 1 | 30mm | EOL '191Q |
4GB | M378A5143EB2 | 512Mx8*8pcs | 4Gb | E-die | 16 | 1 | 30mm | EOL '182Q |
8GB | M378A1K43DB2 | 1Gx8*8pcs | 8Gb | D-die | 16 | 1 | 30mm | CS '182Q |
8GB | M378A1K43CB2 | 1Gx8*8pcs | 8Gb | C-die | 16 | 1 | 30mm | MP |
8GB | M378A1K43CB2 | 1Gx8*8pcs | 8Gb | C-die | 16 | 1 | 30mm | MP |
8GB | M378A1K43BB2 | 1Gx8*8pcs | 8Gb | B-die | 16 | 1 | 30mm | EOL '191Q |
8GB | M378A1K43BB2 | 1Gx8*8pcs | 8Gb | B-die | 16 | 1 | 30mm | EOL '191Q |
8GB | M378A1G43EB1 | 512Mx8*16pcs | 4Gb | E-die | 16 | 2 | 30mm | EOL '182Q |
16GB | M378A2K43DB1 | 1Gx8*16pcs | 8Gb | D-die | 16 | 2 | 30mm | CS '182Q |
16GB | M378A2K43CB1 | 1Gx8*16pcs | 8Gb | C-die | 16 | 2 | 30mm | MP |
16GB | M378A2K43CB1 | 1Gx8*16pcs | 8Gb | C-die | 16 | 2 | 30mm | MP |
16GB | M378A2K43BB1 | 1Gx8*16pcs | 8Gb | B-die | 16 | 2 | 30mm | EOL '191Q |
16GB | M378A2K43BB1 | 1Gx8*16pcs | 8Gb | B-die | 16 | 2 | 30mm | EOL '191Q |
32GB | M378A4G43MB1 | 2Gx8*16pcs | 16Gb | M-die | 16 | 2 | 30mm | CS '182Q |
32GB | M378A4G43AB1 | 2Gx8*16pcs | 16Gb | A-die | 16 | 2 | 30mm | CS '191Q |
SuperBiiz lists part number M378A4G43MB1 as a current, out of stock product, and with no customer reviews…ever. The additional A-Die part number M378A4G43AB1 could potentially increase supply, but only if that increased supply can finally meet the company’s higher-market obligations.
Density | Banks | PartNumber | Pakg&Power, Temp.&Speed | Org. | VDDVoltage | PKG | Avail. |
8GbB-die | 16Banks (4BankGroups) | K4A8G045WB1) | BCPB/RC/TD | 2Gx4 | 1.2V | 78ballFBGA | '192Q EOL |
K4A8G085WB | BCPB/RC/TD | 1Gx8 | |||||
8Banks (2BankGroups) | K4A8G165WB | BCPB/RC/TD | 512Mx16 | 1.2V | 96ballFBGA | ||
8GbC-die | 16Banks (4BankGroups) | K4A8G045WC1) | BCTD/VF/WE | 2Gx4 | 1.2V | 78ballFBGA | MP |
K4A8G085WC | BCTD/*VF/*WE | 1Gx8 | |||||
8Banks (2BankGroups) | K4A8G165WC | BCTD/*VF/*WE | 512Mx16 | 1.2V | 96ballFBGA | ||
8GbD-die | 16Banks (4BankGroups) | K4A8G045WD1) | BC/TD/VF/WE | 2Gx4 | 1.2V | 78ballFBGA | '184Q CS |
K4A8G085WD | BC/TD/*VF/*WE | 1Gx8 | |||||
16GbA-die | 16Banks (4BankGroups) | K4AAG085WA | BCTD/*VF/*WE | 2Gx8 | 1.2V | 78ballFBGA | '191Q CS |
8Banks (2BankGroups) | K4AAG165WA | BCTD/*VF/*WE | 1Gx16 | 1.2V | 96ballFBGA | ||
32GbA-die | 16Banks (4BankGroups) | K4AAG085WA | BCTD/*VF/*WE | 2Gx8 | 1.2V | 78ballFBGA | '191Q CS |
8Banks (2BankGroups) | K4AAG165WA | BCTD/*VF/*WE | 1Gx16 | 1.2V | 96ballFBGA |
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