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Micron offers Taiwan employees $31,650 cash bonus as unions threaten strike over AI windfall
By Etiido Uko Published
Micron is offering Taiwan employees a NT$1 million cash bonus, but unions have rejected the package and are demanding permanent profit sharing as strike talks continue.

Chinese quartz approved for semiconductor equipment and DRAM manufacturing, breaking the US's stranglehold
By Anton Shilov Published
Pacific Quartz gets its high-purity quartz qualified for semiconductor equipment and DRAM manufacturing.

The ABF substrate data center roadmap — solving the supply crunch and material wall beneath every AI accelerator
By Etiido Uko Published
Premium Anjinomoto's secret sauce.

TSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks
By Anton Shilov Published
Premium ASML, Intel, Samsung, and TSMC back development of 6×12-inch to build large processors using High-NA EUV lithography systems without stitching.

TSMC to start using High-NA EUV lithography in 2030
By Anton Shilov Published
TSMC discloses plans to use High-NA EUV lithography in 2030, 6×12-inch photomasks with new scanners in 2033.

Belgian-Chinese semiconductor researcher arrested over alleged GaN trade-secret theft
By Etiido Uko Published
Linked Chinese company was established months after the suspect joined BelGaN

Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined
By Anton Shilov Published
Intel is leading the semiconductor industry with High-NA fleet and process-maturity milestone as it reaches 1 million wafers processed using High-NA tools, moves forward with 6×12 photomask effort.

TSMC fab equipment demand nearly doubles in six months
By Anton Shilov Published
TSMC's equipment requirements have nearly doubled in just eight months as AI demand drives an unprecedented fab expansion, yet its 2026 CapEx budget has risen by only around 15%.
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