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Microsoft unveils Azure Cobalt 200 CPU, in-house chip targets higher performance and deeper integration
Premium Microsoft has revealed its next major in-house server processor, the Azure Cobalt 200, a 132-core Arm-based CPU built on TSMC’s 3nm process.
Netherlands suspends Nexperia takeover order as China eases export curbs
The Dutch government has suspended its emergency order to oversee chipmaker Nexperia, returning operational control to Chinese parent company Wingtech.
1,500% price increase on some rare earth elements squeezes chipmaking business
Yttrium prices are surging as the trade war between China and the U.S. have caused supply to dry up.
High-ranking TSMC executive faces Taiwan legal investigation over murky return to Intel
From Intel to TSMC and back?
Taiwan to spend $3 billion turning nation into 'AI island', targets top five global compute power
Taiwan has formally committed over NT$100 billion (US$3.2 billion) to a new national initiative to turn the island into a global hub for artificial intelligence.
PC hobbyist charged $684 in tariffs on $355 shipment of parts due to classification defaults as low-value import exemptions vanish
A PC hobbyist says he was hit with a $684 tariff bill on a $355 shipment of retro computing parts, in what appears to be a growing pattern tied to changes in federal import rules.
YMTC moves ahead with third chipmaking fab in Wuhan despite U.S. sanctions
Premium Amid a global memory shortage, China's YMTC has set its sights on building a third semiconductor plant in Wuhan, with the facility expected to begin mass production of memory chips by 2027.
Automotive officials warn of 'devastating' chip storage as Nexperia halts China-bound wafer shipments
A growing dispute inside one of Europe’s largest chipmakers is threatening to derail automotive production across the continent.
IBM unveils new 'Quantum Nighthawk' 120-qubit processor and software stack
Premium IBM has detailed its most significant quantum computing advances to date, revealing new hardware and software designed to push the limits of what today’s superconducting qubits can do.
DARPA invests $1.4 billion to build experimental Texas foundry for next-generation 3D chips
Premium A new DARPA- and Texas-backed facility will focus on 3D heterogeneous integration, stacking, and combining multiple materials and chip types to advance U.S. capabilities in defense, AI, and HPC.