Latest about News Analysis
Samsung to adopt hybrid bonding for HBM4 memory
Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.
Tariffs could increase tech prices by up to 70% and reduce GDP by $69 billion according to CTA report
Game consoles will be hit the hardest, and laptops could increase in price by 34%.
Nvidia aims to solve AI's water consumption problems with direct-to-chip cooling — claims 300X improvement with closed-loop systems
Nvidia Blackwell AI datacenters get cooling upgrade
Huawei's new AI CloudMatrix cluster beats Nvidia's GB200 by brute force, uses 4X the power
Huawei unveils AI CloudMatrix 384 system based on 384 Ascend 910C processors that can beat Nvidia's GB200 NVL72 in performance, but at the cost of efficiency.
Made in the USA: Inside Nvidia's $500 billion server gambit
The scale and timeline of Nvidia's plans to build AI server supply chain in the U.S. look ambitious, but can they actually be fulfilled?
China's new semiconductor rule spares Taiwan fabs, punishes Intel, GlobalFoundries & Texas Instruments
Killing two birds with one stone.
