Phones using the new 3 GB LPDDR3 module will appear in the second half of 2013.
Samsung said on Tuesday night that it's the first company to mass produce 3 GB LPDDR3 mobile DRAM, the highest density mobile memory solution for next-generation smartphones. Given that the typical mainstream computer has 4 GB of RAM and a dual-core processor at the least, Samsung said offering 3 GB of RAM on a smartphone should help narrow the performance gap between the two form factors. Currently, the most RAM that's packed into a smartphone is 2 GB.
The new 3 GB module uses six of the industry’s smallest 20 nm class 4 Gb LPDDR3 chips (meaning a process technology node somewhere between 20 and 30 nm), in a symmetrical structure of two sets of three chips stacked in a single package only 0.8 millimeters high. The module is capable of data transfer speeds of up to 2,133 Mbps per pin, the company said.
The new 3 GB LPDDR3 DRAM module connects with a mobile SoC using two symmetrical data transfer channels, each connected to a 1.5 GB storage part. Samsung acknowledged that symmetrical data flow can cause "sharp" performance dips at certain settings, but the company claims its symmetrical structure avoids those issues while also maximizing system level performance.
"With a full line-up of package dimensions, Samsung’s new ultra-slim memory solutions will enable thinner smartphone designs and allow for additional battery space," the company said. "With the increased mobile DRAM capacity, users can enjoy seamless high-quality, Full HD video playback and faster multitasking on their smartphones. Also, the new LPDDR3 speeds up data downloading and is able to offer full support for LTE-A (LTE Advanced) service, a next-generation mobile telecommunication standard."
Samsung said that the new 3 GB module will be adopted in the most up-to-date smartphones starting in the second half of 2013, and expand into high-end smartphones worldwide throughout 2014. Meanwhile, Samsung is developing a new 3 GB LPDDR3 solution based on 6 Gb LPDDR3 chips by symmetrically stacking two chips on each side. This version will be made available to smartphone makers by the end of the year.