Altera has announced that it will once again be partnering with the Taiwan Semiconductor Manufacturing Company (TSMC) to develop 55 nm embedded flash (EmbFlash) technology. When compared to the previous generation, it will deliver faster computing, possess a tenfold increase in gate density, and shrink the flash and SRAM cell sizes by 70 and 80 percent, respectively.
The ultimate aim of this initiative is to permit developers of high-volume applications to build feature-rich, non-volatile systems for a range of markets including "automotive and industry."
"Our relationship with TSMC is built on a shared commitment to delivering the latest technologies and capabilities to customers,” said Reda Razouk, Vice President of Process Technology Development at Altera. "Adding 55nm EmbFlash to our product portfolio extends Altera’s tailored strategy in which Altera optimizes its device families based on process technology, architecture and application-specific IP to meet system requirements.”