Intel to Reveal Process and Packaging Technology Roadmap During July 26 Webcast

Intel today announced that CEO Pat Gelsinger and Technology Department head Dr. Ann Kelleher would discuss upcoming "process and packaging innovations" on July 26.

Gelsinger and Kelleher "will provide a deeper look at Intel’s process and packaging roadmaps" as part of the IDM 2.0 strategy revealed in March.

Intel didn't reveal much else about what Gelsinger and Kelleher plan to discuss during the webcast. The event will be streamed on July 26 at 2pm PT via the Intel Newsroom; it will also be available to watch on-demand after the stream ends.

Nathaniel Mott
Freelance News & Features Writer

Nathaniel Mott is a freelance news and features writer for Tom's Hardware US, covering breaking news, security, and the silliest aspects of the tech industry.