Semiconductor Researchers Solve Diamond Wafer Slicing Challenges With Lasers

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(Image credit: Shutterstock)
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Despite all its winning qualities for semiconductor industry use, diamond has been held back as it has been hard to fashion into usable wafers. On Tuesday, a representative from Chiba University in Japan emailed us about a breakthrough described as a novel laser-slicing technique for diamond semiconductors.

diamond wafer slicing

(Image credit: Chiba University)
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Mark Tyson
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Mark Tyson is a news editor at Tom's Hardware. He enjoys covering the full breadth of PC tech; from business and semiconductor design to products approaching the edge of reason.

  • LostFate
    Great... Now I have to replace all my gold plated, zero oxygen, fiber optic cables again...
    Reply
  • Eximo
    Freakin' laser beams.

    Basically they are saying that adding a lot of energy turns it from diamond to some other carbon allotrope and then they just break it, or it breaks, upon the lines made by the laser.

    Not sure why this wasn't a thing before?

    Deliberately reaching out to news outlets is not a great sign...
    Reply
  • InvalidError
    Eximo said:
    Not sure why this wasn't a thing before?
    Sub-surface laser focusing is how multi-layer BD discs work and also how designs get etched in acrylic cubes. Not really a new process, just a new higher-energy, higher-precision application for it.

    Great, they solved the diamond-slicing problem. Still got to work on growing cheaper diamond wafers. Not sure the consumer electronics and automotive space is sufficiently concerned about efficiency to spend $60 000 per 3" diamond wafer just to gain another 1-2% on efficiency.
    Reply