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Lumentum CEO warns of impending bottleneck on critical material used for silicon photonics
Premium Lumentum CEO Michael Hurlston told an audience at the RAISE Summit that indium phosphide is heading into a squeeze worse than the one in memory.
Shanghai Aishengna named as the maker of China's first domestic immersion DUV chipmaking tools
Premium Aishengna has been named by a single source who declined to be named, and its shareholders, SMEE, and Yuliangsheng didn’t respond to requests for comment.
China begins mass production of homegrown immersion chipmaking machines in major breakthrough, report claims
A state-backed company in Shanghai has begun mass-producing immersion deep ultraviolet lithography machines and is due to deliver the first units this year.
New semiconductor firm, TYLsemi, breaks cover, backed by $43 million in early-stage funding
Premium TYLsemi is set to offer pre-validated chiplets, along with custom ASIC design services, and build highly custom multi-tile processors at relatively low costs.
Intel 4 gets its first foundry customer in Fortinet following firewall ASIC deal
Premium Intel will design, package, and fabricate Fortinet's sixth-generation Security Processor (SP6) on its Intel 4 node.
Intel to co-develop and manufacture Fortinet's next-gen firewall ASIC
SP6 will draw on what the companies described as Intel's expertise in disaggregated semiconductor design and advanced packaging.
TSMC eyes price hikes of up to 25% on chip production services in 2027, report claims
TSMC reportedly intends to increase prices of wafers it processes citing demand, rising costs, and increased investments in new capacity.
SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV
SMIC's N+3 process technology can achieve transistor density comparable to TSMC's N6 without using EUV lithography, but it fails to deliver performance or efficiency of modern production nodes.
